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Ultra-hard Clad Layer Slot Die

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Material supply system
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Flat Coating Equipment
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Flat coating equipment
Flat coating equipment： Process Size: 300mm-600mm; Automatic blade alignment, automatic cleaning and laser distance measurement; Coating Uniformity within 5%; Human-Machine Interface (HMI) supports both mannual and automatic operations, offering advanced intelligent control.

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Flat Coating Equipment
Flat Coating Equipment: Process Size: 600mm-1200mm; Automatic blade alignment, automatic cleaning and laser distance measurement; Coating Uniformity within 5%; Human-Machine Interface (HMI) supports both mannual and automatic operations, offering advanced intelligent control.

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Experimental Vacuum Drying Equipment (VCD)
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Mass production type Vacuum Drying Equipment (VCD)
Mass production type Vacuum Drying Equipment (VCD) Applicable dimensions: 210mm-1200mm; Imported Dry Pump； Pumping Rate：10s/10Pa; Automated Control System.

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Semi Automatic Wafer Mounter
Semi Automatic Wafer Mounter : Working Principle: Antistatic roller for Wafer Mounter; Wafer Mounter Method: Automatic film feeding and lamination； Wafer stage Chuck: Contact chuck with anti-static Teflon (PTFE) coating Anti-static control: Contact chuck with anti-static Teflon (PTFE) coating/Anti-static rollers/Except for static ion generators; Cutting system: Equipped with an uniquely designed manually adjustable circle cutter compatible with various sizes. Loading/Unloading Operations: Manual placement and removal of wafers. Wafer Alignment: Universal alignment and locating pin for precise positioning. Control Unit: PLC-based control system with a large-format touchscreen interface.

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Semi-automatic Wafer Detaper：
Semi-automatic Wafer Detaper： Wafer size: 6 ", 8"； Thickness: 200-750 μ m; Wafer type: silicon, gallium kunide or other materials; Types of film removal adhesive: Tape film removal； Width: 38-100 millimeters; Length: 100 meters Wafer Detaper Angle: less than 45degrees, and adjustable from 5° to 45°. Wafer Detaper Temperature: Adjustable within the range of room temperature to 100 ℃, temperature control accuracy: +/-5℃; Wafer stage chuck: Contact chuck with anti-static Teflon (PTFE) coating ; It has a controllable heating function, with a maximum temperature of up to 100℃. The wafer stage chuck is equipped with vacuum suction function. Loading and unloading method: Manual placement and removal of wafers

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Fully Automatic Wafer Mounter
Fully Automatic Wafer Mounter ： Wafer size: 6, 8 inches Wafer Thickness: 100–750 μm Wafer Types: Silicon, Gallium Arsenide (GaAs), or other materials Film Types: Blue protection tape or UV preservation film Loading/Unloading Operation: Automated input and output cassette system Wafer stage Chuck: Contact chuck with anti-static Teflon (PTFE) coating Working Principle: Antistatic roller for Wafer Mounter; Chuck Temperature: Adjustable from room temperature up to 100 °C (optional) Lamination Accuracy: X-Y ±0.25 mm, θ ±0.5° Alignment: X-Y-θ offset correction, non-contact optical beam sensors

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Fully automatic Wafer Detaper
Fully automatic Wafer Detaper： Wafer size: 6 inches, 8 inches; ; 75-725um；Wafer thickness: 75-725 μ m Wafer type: silicon, gallium arsenide or other materials Film type: Blue film, ultraviolet film, dry film or other encapsulation films; Wafer Chuck: Contact chuck with anti-static Teflon (PTFE) coating Anti-static control: Contact chuck with anti-static Teflon (PTFE) coating /Anti-static lamination rollers/Air ioniser; Chuck Temperature: Room temperature to 150 °C Film tearing mechanism: Robot exploitation Separation Angle: 0 ° to 45°

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TEL：      021-64896449

TEL：      Mr.Chen  +08613601864631

                Mr.Lin      +08613370081160

ADDRESS: Buildings 1, 3 and 5, No. 1259, Ping 'an Road, Minhang District, Shanghai

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