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Fully automatic Wafer Detaper

Fully automatic Wafer Detaper：

Wafer size: 6 inches, 8 inches;    

75-725um；Wafer thickness: 75-725 μ m

Wafer type: silicon, gallium arsenide or other materials

Film type: Blue film, ultraviolet film, dry film or other encapsulation films;

Wafer Chuck: Contact chuck with anti-static Teflon (PTFE) coating

Anti-static control: Contact chuck with anti-static Teflon (PTFE) coating

/Anti-static lamination rollers/Air ioniser;

Chuck Temperature: Room temperature to 150 °C

Film tearing mechanism: Robot exploitation

Separation Angle: 0 ° to 45°

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TEL：      021-64896449

TEL：      Mr.Chen  +08613601864631

                Mr.Lin      +08613370081160

ADDRESS: Buildings 1, 3 and 5, No. 1259, Ping 'an Road, Minhang District, Shanghai

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