Semi-automatic Wafer Detaper：

Semi-automatic Wafer Detaper：

Wafer size: 6 ", 8"； Thickness: 200-750 μ m;

Wafer type: silicon, gallium kunide or other materials;

Types of film removal adhesive: Tape film removal；

Width: 38-100 millimeters; Length: 100 meters

Wafer Detaper Angle: less than 45degrees, and adjustable from 5° to 45°.

Wafer Detaper Temperature: Adjustable within the range of room temperature to 100 ℃, temperature control accuracy: +/-5℃;

Wafer stage chuck: Contact chuck with anti-static Teflon (PTFE) coating

; It has a controllable heating function, with a maximum temperature of up to 100℃.

The wafer stage chuck is equipped with vacuum suction function.

Loading and unloading method: Manual placement and removal of wafers