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Flat coating equipment

Flat coating equipment：

Process Size: 300mm-600mm;

Automatic blade alignment, automatic cleaning and laser distance measurement;

Coating Uniformity within 5%;

Human-Machine Interface (HMI) supports both mannual and automatic operations, offering advanced intelligent control.

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Mass production type Vacuum Drying Equipment (VCD)
Mass production type Vacuum Drying Equipment (VCD) Applicable dimensions: 210mm-1200mm; Imported Dry Pump； Pumping Rate：10s/10Pa; Automated Control System.

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Semi Automatic Wafer Mounter
Semi Automatic Wafer Mounter : Working Principle: Antistatic roller for Wafer Mounter; Wafer Mounter Method: Automatic film feeding and lamination； Wafer stage Chuck: Contact chuck with anti-static Teflon (PTFE) coating Anti-static control: Contact chuck with anti-static Teflon (PTFE) coating/Anti-static rollers/Except for static ion generators; Cutting system: Equipped with an uniquely designed manually adjustable circle cutter compatible with various sizes. Loading/Unloading Operations: Manual placement and removal of wafers. Wafer Alignment: Universal alignment and locating pin for precise positioning. Control Unit: PLC-based control system with a large-format touchscreen interface.

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Semi-automatic Wafer Detaper：
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Fully Automatic Wafer Mounter
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Fully automatic Wafer Detaper
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Ceramic Heating Plate
Ceramic Heating Plate： Leveraging the excellent insulation and thermal conductivity of ceramic, it achieves precise temperature control, efficiently carrying out processes such as baking and photoresist removal with high stability and reliability. For printed heaters (glass/aluminum substrates): Glass substrates offer corrosion resistance and high cleanliness, while aluminum substrates provide rapid heat conduction. Utilizing thin-film circuit printing technology ensures uniform heat distribution, making it suitable for precision temperature control applications such as laboratory and optical equipment.

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Plasma RF Coil (For Semiconductor Etching)
Plasma RF Coil (For Semiconductor Etching)： The Plasma RF Coil is one of the core components for generating and sustaining low-temperature plasma. Its primary function is to efficiently and controllably couple RF power into the working gas, ionizing the gas and maintaining a stable plasma state.

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TEL：      021-64896449

TEL：      Mr.Chen  +08613601864631

                Mr.Lin      +08613370081160

ADDRESS: Buildings 1, 3 and 5, No. 1259, Ping 'an Road, Minhang District, Shanghai

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