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Fully automatic Wafer Detaper：
Wafer size: 6 inches, 8 inches; ;
75-725um；Wafer thickness: 75-725 μ m
Wafer type: silicon, gallium arsenide or other materials
Film type: Blue film, ultraviolet film, dry film or other encapsulation films;
Wafer Chuck: Contact chuck with anti-static Teflon (PTFE) coating
Anti-static control: Contact chuck with anti-static Teflon (PTFE) coating
/Anti-static lamination rollers/Air ioniser;
Chuck Temperature: Room temperature to 150 °C
Film tearing mechanism: Robot exploitation
Separation Angle: 0 ° to 45°
TEL： 021-64896449
TEL： Mr.Chen +08613601864631
Mr.Lin +08613370081160
ADDRESS: Buildings 1, 3 and 5, No. 1259, Ping 'an Road, Minhang District, Shanghai
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