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Semi-automatic Wafer Detaper：
Wafer size: 6 ", 8"； Thickness: 200-750 μ m;
Wafer type: silicon, gallium kunide or other materials;
Types of film removal adhesive: Tape film removal；
Width: 38-100 millimeters; Length: 100 meters
Wafer Detaper Angle: less than 45degrees, and adjustable from 5° to 45°.
Wafer Detaper Temperature: Adjustable within the range of room temperature to 100 ℃, temperature control accuracy: +/-5℃;
Wafer stage chuck: Contact chuck with anti-static Teflon (PTFE) coating
; It has a controllable heating function, with a maximum temperature of up to 100℃.
The wafer stage chuck is equipped with vacuum suction function.
Loading and unloading method: Manual placement and removal of wafers
TEL： 021-64896449
TEL： Mr.Chen +08613601864631
Mr.Lin +08613370081160
ADDRESS: Buildings 1, 3 and 5, No. 1259, Ping 'an Road, Minhang District, Shanghai
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